3D Semiconductor Packaging Covid 19 – Sales Revenue and Regional Forecast 2023

A recently released new research by Market Research Future predicts that the global 3D semiconductor packaging market size will be fueling up during the forecast period from 2018 to 2023, at 16.25%CAGR, and would gain a higher valuation of USD 37,400 million.

The market is enduring an exacting period with its robust growth coming to an abrupt halt in light of the COVID-19 pandemic. MRFR report on market highlights the future prediction and the growth alternatives that can be created.

Segmentation of Market:

The report further includes a detailed segmental analysis of 3D Semiconductor Packaging Covid 19 based on the type, packaging method, and end-user.

Segmentation by type: 3D SIP, 3D WLP, 3D SIC, and 3D IC are the segments. Wherein, the 3D SIP segment occupied the largest market share of 33.5% in 2017 and is now estimated to observe a CAGR of 15.0% during the forecast period. 3D SIP is generally used in high-margin, high-price, and high-end products such as dual-lens camera modules.

Segmentation by packaging method: Package on the package, through silicon via (TSV), through glass via (TGV) and many more. Among which, the through silicon via (TSV) segment is currently accounting to have the largest market share and is probable to remain highly profitable from 2019 and beyond.

Segmentation by end-user: Consumer electronics, telecommunication, industrial, automotive, military and aerospace, and others are the segments. Wherein, the consumer electronics segment is measured to retain at its top position over 2023. The segment has the probability of surpassing a market valuation of USD 11,700 million by the prediction period. Also, the telecommunication segment held for the second largest market share and is now ready to capture a CAGR of 17.9%.

Key Market Players

The top-notch market players stated in the report of MRFR thus, include Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Xilinx Inc., STMicroelectronics NV, Siliconware Precision Industries Co., Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., ams AG and Amkor Tecnhology Inc. and Samsung Electronics Corporation Ltd.

About Market Research Future:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.


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